Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass ...

With the advancement of artificial intelligence (AI) semiconductors, various issues have arisen in packaging, leading to growing interest in glass substrates, which offer significant technological ...

Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...

Advanced packaging technologies and high-bandwidth memory (HBM) have fueled a surge in global chip demand. Beneath the ...

These days when we talk about what's next for chip design, we focus on things like cramming in more cores, increasing clock speeds, shrinking transistors and 3D stacking. We rarely think about the ...

Intel has revealed more details today about its "breakthrough" glass substrate technology - a new way to manufacture processors that promises numerous benefits to todays standard organic substrate ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...

Join the event trusted by enterprise leaders for nearly two decades. VB Transform brings together the people building real enterprise AI strategy. Learn more Intel said it has made a significant ...

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...

TAIPEI, Taiwan — A Taiwanese chemical lab is in the early stages of commercializing a new class of plastic material aimed at making high-quality, yet lower-cost substrates for next generation ...

AMD has been granted a patent (12080632) that covers glass core substrate technology. For those who came in late, glass substrates, made from materials like borosilicate, quartz, and fused silica, ...

Corning has disclosed plans to hike its display glass substrate prices in the second quarter of 2021 to reflect increased costs in logistics, energy, raw materials and other operational expenses ...