Nvidia Corp (NASDAQ:NVDA) plans to use Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips earlier than scheduled to address the production constraints of Chip on Wafer on ...

Taiwan Semiconductor Mfg. Co. Ltd. (NYSE:TSM) is set to double its production capacity for advanced packaging, a move driven by the increasing demand for artificial intelligence chips from major ...

WASHINGTON (Reuters) - The U.S. Commerce Department said on Tuesday it plans to award SK Hynix up to $450 million in grants to help fund an advanced packaging plant and research and development ...

The chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good ...

TSMC, the world’s leading semiconductor manufacturer, has announced that its advanced packaging capacity is fully booked for the next two years. This development comes as Nvidia, AMD, and Guanghuida ...

According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in 2024 to 53.4 million units in 2030. This data center ...

MALTA, N.Y. (NEWS10) — GlobalFoundries will create a new center for chip packaging and testing in Malta, the company announced on Friday. The facility will be called the New York Advanced Packaging ...

According to South Korean technology outlet , SK hynix is reviewing plans to build its first 2.5D advanced packaging mass production line in the US, a move that would deepen the South Korean memory ...

Intel is starting to reveal more details about its upcoming Core Ultra Series 3 “Panther Lake” chips for mobile devices. Unsurprisingly the company is promising big performance and efficiency gains – ...