The 3HTND-2DA is a one-component, toughened, electrically insulating epoxy for die attaches applications. It has an exceptional electrical insulation properties and thermal conductivity, and very long ...

The Master Bond EP3HTSDA-1 is a fast curing, one part, conductive epoxy system primarily for die attach applications. It is not premixed and frozen and has an unlimited working life at room ...

Master Bond's advanced die-attach adhesives are increasingly accepted for the most demanding microelectronic semiconductor packaging as well as for chips-on-board assemblies. Both one component heat ...

Master Bond has formulated a line of one component epoxy underfill compositions which feature rapid cures at moderately elevated temperatures and offer excellent underfill-to-die passivation as well ...

Two-component epoxies, which require mixing resin and curing agent before use, often suffer from issues such as mixing ratio errors, limited working times, and inconsistent curing. Additionally, they ...