Venkat Nandivada, Manager of Technical Support at Master Bond Inc, talks to AZoM about die attach adhesives used in semiconductor assembly. Beyond their ability to form a tight bond between die and ...

Master Bond's advanced die-attach adhesives are increasingly accepted for the most demanding microelectronic semiconductor packaging as well as for chips-on-board assemblies. Both one component heat ...

Smaller PCBs, including rigid-flex circuits, call for die attach using one of three methodologies, depending on the application Technologies that for years were the sole domain of semiconductor ...

High-power semiconductor applications currently represent one of the highest growth sectors of any semiconductor technology, specifically because many of the key applications are driven by the ...

The 3HTND-2DA is a one-component, toughened, electrically insulating epoxy for die attaches applications. It has an exceptional electrical insulation properties and thermal conductivity, and very long ...

Description: This product is a fast curing, one-part, conductive epoxy system primarily for die attach applications. It is not pre-mixed or frozen and has an unlimited working life at room temperature ...