"This new group integrates KLA's acquisition of the Orbotech and SPTS business to bring complementary technologies, products and services into one organization to drive innovation and results in ...

Printed Electronics is key in enabling smart packaging innovations, a fast growing market for industry, researchers say. The smart packaging market is expected to grow to more than US$ 1.45 billion in ...

PISCATAWAY, N.J.--(BUSINESS WIRE)--IEEE, the world's largest technical professional organization dedicated to advancing technology for humanity, and the IEEE Electronics Packaging Society (EPS) today ...

Brian Narveson, Independent Consultant and PSMA Board Member, and Greg Evans, CEO, WelComm Inc., and PSMA Marketing Committee, contributed to this article. It’s always been inevitable, that in system ...

Flexible hybrid electronics (FHE) has spawned the development of novel packaging techniques to overcome the application limitations of the rigid boards, high-temperature solders, bulky component ...

Nordson’s industry-leading ASYMTEK Vantage® Series fluid dispensing system equipped with the ASYMTEK IntelliJet® Jetting system is driving innovations for underfilling during semiconductor advanced ...

A recent FB post on the “AV Install Nightmares” has me thinking: do AV installers care enough about electronics packaging waste? Based on the replies to that post, it seems as though the answer is ...

As India's semiconductor ambitions take shape, Henkel, the global industrial adhesives and electronics packaging giant, is positioning itself to support the country's emerging semiconductor ecosystem.

Electronic Vehicles (EVs) have been at the center of attention in recent years. With the automotive industry becoming more aligned with sustainable development goals, the focus has shifted toward EVs ...

In an era of collapsing economies, waning affluence, and too much garbage amid scarcity, a characteristic that is part of the engineering character – resourcefulness – is due to come back in vogue, as ...

Demands for lower-cost, higher-density, and smaller-footprint ICs aimed at portable electronics make 3D-packaging designers sweat. The push for 3D packaging of semiconductor ICs directly results from ...