BUFFALO, N.Y. -- Some of the world's most advanced research in micro- and nanoelectronic-packaging reliability is taking place in the Electronic Packaging Laboratory in the University at Buffalo ...

Some of the world's most advanced research in micro- and nanoelectronic-packaging reliability is taking place in the Electronic Packaging Laboratory in the UB School of Engineering and Applied ...

Most of us use our cell phones, smart watches and other electronic devices without giving much thought to the components and how they fit and work together. But it’s a complex problem that ...

It's the 'real' thing. A grant from the National Science Foundation will help Rochester Institute of Technology launch REAL: The Reliability Education and Analysis Laboratory. The lab, part of RIT's ...

Some of the world's most advanced research in micro- and nanoelectronic-packaging reliability is taking place in the Electronic Packaging Laboratory in Some of the world's most advanced research in ...

YAVNE, Israel, May 16, 2018 /PRNewswire/ -- Orbotech Ltd., (NASDAQ: ORBK) a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products, and A ...

A University at Buffalo electronic-packaging researcher is helping the U.S. Navy to develop a next generation all-electric warship that will revolutionize the Navy's use of weaponry and manpower.

As India's semiconductor ambitions take shape, Henkel, the global industrial adhesives and electronics packaging giant, is positioning itself to support the country's emerging semiconductor ecosystem.