Panasonic Corporation announced today that it has commercialized the first sulfur-free *2 encapsulation molding compound (EMC) for copper wire bonding in the industry *1, and will start mass ...
Mold-encapsulated glass for automotive applications based on a polyurethane (PUR) flush sealing technique is less prone to breakage than conventional processes, according to BBG GmbH, a mold maker and ...
EC Electronics is offering low-pressure over-moulding encapsulation for PCBs and cable assemblies from its facilities in the UK and Romania. “All four factories will offer over-moulding: Basingstoke ...
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