SHANGHAI, Dec. 10, 2025 /PRNewswire/ -- USI's MCC has developed a new packaging approach that integrates Vacuum Printing Encapsulation (VPE) with high–aspect ratio copper pillar mass-transfer ...

The Centre for Process Innovation (CPI) has recently installed a specialist roll to roll line for the printing, coating and patterning of a range organic and inorganic solution based coatings. The ...

OSAKA, Japan--(BUSINESS WIRE)--Panasonic Corporation today announced that it has commercialized an encapsulation material having a high dielectric constant that is suitable for finger-print ...

Start-up semiconductor packaging supplier Ziptronix Inc. has developed a MEMS encapsulation process it said can reduce the high packaging costs that have delayed the acceptance of MEMS technology. The ...