OSAKA, Japan--(BUSINESS WIRE)--Panasonic Corporation announced that it has developed a sheet-form encapsulation material (CV2008 series) for coreless package substrates that enables thinner-profile ...
Researchers in Japan have developed an effective encapsulation with a PET front cover for copper indium gallium diselenide mini-modules. The lab devices withstood damp heat tests, retaining ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback