TOKYO--(BUSINESS WIRE)-- Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...
SHENZHEN, China, Dec. 8, 2025 /PRNewswire/ -- PCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology ...
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BOE reportedly mulls producing glass substrates for China's CPUs — new focus on semiconductors
BOE, a leading Chinese maker of LCD and OLED displays, is looking to make glass core substrates for next-generation domestic processors, Nikkei reports. The company plans to launch a pilot production ...
Intel has revealed more details today about its "breakthrough" glass substrate technology - a new way to manufacture processors that promises numerous benefits to todays standard organic substrate ...
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