Startup Substrate is building next-generation semiconductor fabs using advanced X-ray lithography. This goes beyond extreme ...

It's not just AMD, but Intel, Samsung, LG Innotek, and SK Group's US subsidiary Absolics are all systems pushing into glass substrate technology for advanced packaging. Intel announced in September ...

TOKYO--(BUSINESS WIRE)-- Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...

Intel has confirmed to South Korean media that it will proceed with its semiconductor glass substrate commercialization plans as originally outlined, dismissing reports of potential withdrawal amid ...

TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...

A secretive American startup has emerged with aspirations to challenge two titans of the semiconductor industry: ASML Holding NV and Taiwan Semiconductor Manufacturing Co. The company, Substrate, has ...

The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is projected to reach a revised size of USD 14630 Million by 2031, growing at a CAGR of 6.8% ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...