TOKYO, Dec. 07, 2023 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced three new additions to its suite of memory test products. The ...

TL;DR: SK hynix is reportedly planning to introduce femto-second grooving and full-cut processes to its HBM4 and 400-layer and higher NAND flash, a move required as semiconductors get thinner and ...

The supply landscape for 3D NAND wafers is being structurally reshaped as major manufacturers shift capacity aggressively toward enterprise storage. While output of mainstream 1Tb dies is ramping ...

TrendForce reported on December 1 that NAND Flash wafer supply tightened sharply in November as AI workloads and enterprise SSD orders continued to drive sustained demand. The firm said suppliers have ...

Memory chip makers' strict production cuts have managed to shore up the NAND wafer prices, with module houses scrambling to secure supply, according to industry sources. Some subscribers prefer to ...

SINGAPORE, Jan. 27, 2026 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (MU) broke ground today on an advanced wafer fabrication facility located within the company's existing NAND manufacturing complex ...

Companies Preview 10th Generation 3D Flash Memory Technology Setting A New Benchmark for Performance, Power Efficiency and Bit Density Unveiled at ISSCC 2025, the new 3D flash memory innovation, ...

Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...

The global NAND flash memory market has been suffering from oversupply all year, keeping chip prices down, and a new factory built by Hynix shows why: Companies have built too many new factories.

Stacking chiplets vertically using short and direct wafer-to-wafer bonds can reduce signal delay to negligible levels, enabling smaller, thinner packages with faster memory/processor speeds and lower ...