Several equipment makers are ramping up new inspection equipment to address the growing defect challenges in IC packaging. At one time, finding defects in packaging was relatively straightforward. But ...

Much has changed in IC packaging technology since the first real-time microfocus X-ray systems entered the inspection market nearly 20 years ago. The trend for high-density packaging is moving from ...

Preventing leaks and seal failures in sterile packaging is vital for patient safety. Learn how vacuum decay and airborne ...

Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...

PTI will showcase VeriPac Package Quality Inspection Systems during Interphex, April 21-23 at the Jacob Javits Center in New York City, Booth 2145B. CCIT of syringes, liquid filled & lyophilized vials ...