Paras Defence launched Paras Semiconductor to set up advanced heterogeneous & 3D chip packaging, strengthening India’s ...

New subsidiary to focus on advanced semiconductor packaging for defence and strategic electronics – Paras would be setting up India’s first advanced heterogeneous & 3D packaging ...

The group is also building an OSAT facility. This is in view of a larger plan to create a hub for chiplet integration and ...

Paras Defence and Space Technologies Ltd. on Monday announced the launch of a new subsidiary, Paras Semiconductor Pvt. Ltd., marking its entry into the semiconductor segment with a focus on advanced ...

BE Semiconductor Industries N.V. surges on AI data center demand and advanced packaging, lifting revenue targets and ...

Nvidia partnerships, $7B Arizona advanced packaging, 2026 growth catalysts & undervalued P/S vs. peers. Click here for more ...

TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, announced today it has signed a non-binding preliminary ...

Vietnam's military-run telecom company Viettel on Friday began construction of the country's first semiconductor fabrication plant, with trial production expected to start by late 2027, part of ...

BE Semiconductor Industries N.V. (Euronext: BESI), a leading Dutch semiconductor assembly equipment manufacturer, reported ...

Malaysia and Taiwan were among the early semiconductor outposts during the late 1960s when U.S. companies like Intel began to outsource their assembly and test operations to Asia. Over half a century, ...

As artificial intelligence (AI) continues to reshape industries worldwide, the demand for smarter, faster, and more efficient electronic systems has never been greater. AI-enabled applications-from ...

Analysts remains positive on Mi Technovation Bhd, as they see the group's diversification strategy "falling into place" and ...