Mini LED chips can measure as small as 50μm × 100μm, with pad spacing as narrow as 5-50μm, demanding extreme precision in ...
(MENAFN- GetNews) As we know, solder paste printing is an essential section in the process of SMT (Surface Mount Technology). Due to the solder paste is a mixture of powder and flux, its fluidity ...
With stencil printing, before production can start, the stencil has to be carefully engineered and often with a compromise and then manufactured from an external supplier. A production operative then ...
As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...
(MENAFN- GetNews) The main difference between SMT SPI and AOI machine is that SPI is a quality check for paste presses after stencil printer printing, through the inspection data to solder paste ...
3-D techniques have the potential to offer a quantum leap in performance levels for advanced test and measurement equipment. Human vision and perception of the world rely on the ability to view ...
EMS companies who produce PCBA’s have been using stencils for decades, to apply solder paste to boards, but this traditional method may one day be a thing of the past. Adam Harsant, Director at ...
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