SEOUL, South Korea, July 14, 2025 /PRNewswire/ -- JNTC Co., Ltd. (KOSDAQ: 204270), a leading advanced materials company, hosted a product launch on June 30 at the Korea Exchange Conference Hall, ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is projected to reach a revised size of USD 14630 Million by 2031, growing at a CAGR of 6.8% ...

TOKYO — Matsushita Electric Industrial Co. Ltd. has developed a three-dimensional, multilayered module technology that connects systems-on-chip with passive components by embedding them in substrate ...

Samsung Electro-Mechanics announced on the 4th that it will unveil its next-generation semiconductor substrate technology at the 'International PCB and Semiconductor Packaging Industry Exhibition ...

Riding the artificial intelligence (AI) boom, electronic component companies are also recording strong performances. The ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

This application note presents the recent achievements and approaches for further optimization of high current, low voltage, and power semiconductor components. It presents the technology and ...

CEO Andrew Cho introduced the proprietary TGV glass substrate as a breakthrough solution to the limitations of plastic-based substrates. Designed for AI and high-performance computing applications, ...