Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...
This study investigates creation of 1.0µm RDL structures by a damascene process utilizing a photosensitive permanent dielectric material. The advantage of the photosensitive dielectric approach is ...
Ring-oscillator process monitors give production test teams a fast on-die frequency measurement for identifying CMOS process ...
Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...
Qnity targets AI packaging with new interposer materials for glass substrates and advanced semiconductor packaging.
SAN JOSE — A consortium of chip-equipment makers here today announced a major deal with Ace Semiconductor to help set up the world's first wafer-level packaging production line in China. Under the ...
Moore’s Law in process technology is on its last legs, so advanced packaging is taking up the baton. Advanced techniques such as fan-out wafer-level packaging (FOWLP) allow increased component density ...
Delo is proposing low-viscosity UV-curable moulding compounds for FOWLP – fan-out wafer-level packaging. “With the use of UV-curable molding materials instead of heat curing ones, warpage and die ...
Intel's recent earnings call highlighted a significant challenge affecting their production schedule: the company's wafer-level packaging capabilities are currently insufficient to meet the growing ...
Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed at assisting companies ...
In May 2026, Applied Materials, Inc. reported second‑quarter 2026 sales of US$7.91 billion and net income of US$2.81 billion, raised guidance for third‑quarter 2026 revenue to about US$8.95 billion ...