In a new weekly update for pv magazine, OPIS, a Dow Jones company, provides a quick look at the main price trends in the global PV industry. FOB China prices for M10 wafers have remained stable for ...
With a thickness of only 20 µm and a diameter of 300 mm, Infineon’s silicon power wafers are the thinnest in the industry. These ultra-thin wafers are a quarter the thickness of a human hair and half ...
(RTTNews) - German semiconductor maker Infineon Technologies AG (IFNNY) announced Wednesday the development of the world's first 300 mm power gallium nitride or GaN wafer technology. The ...
While artificial intelligence (AI) stocks have delivered explosive returns in recent years, none have kept pace with AXT ...
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Wafer-scale accelerators could redefine AI
The promise of a new type of computer chip that could reshape the future of artificial intelligence and be more environmentally friendly is explored in a technology review paper published by UC ...
GRESHAM, Ore. and TOKYO , June 10, 2024 /PRNewswire/ — Element Six (E6) and Orbray, both world leaders in high-performing advanced materials, today announced a strategic collaboration to deliver the ...
PHOENIX, Oct. 07, 2025 (GLOBE NEWSWIRE) -- SEMICON WEST -- ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today ...
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TSMC could charge up to $45,000 for 1.6nm wafers — rumors allege a 50% increase in pricing over prior-gen wafers
As TSMC is gearing up to start making chips on its N2 (2nm-class) process technology later this year, rumors have emerged regarding the pricing of N2 wafers, as well as the pricing of subsequent nodes ...
Infineon Technologies (OTCQX:IFNNY) on Wednesday said it is looking to grab a share of the growing gallium nitride (GaN) market with the development of a new technology, that could help in bringing ...
BEDFORD, Mass.--(BUSINESS WIRE)--Silicon wafer manufacturer 1366 Technologies today announced a new performance record for its Direct Wafer® technology with the achievement of 19.9% cell efficiency ...
BBCube™: Bumpless Build Cube. A bumpless three-dimensional semiconductor integrating technology can address the challenges posed by traditional system-in-package (SiP) approaches. A novel power ...
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