New generations of small medical electronics devices demand the highest levels of quality and reliability For EMS providers and contract manufacturers, the International Standards Organization (ISO) ...
As much of the industry moves toward lead-free processes, gold wire is emerging as an alternative. For example, Palomar Technologies' Model 8000 gold ball-and-stitch thermosonic wire bonder is now ...
NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is ...
A surge in demand for IC packages is causing long lead times for wire bonders, which are used to assemble three-fourths of the world’s packages. The wire bonder market doubled last year, alongside ...
2D cameras for positioning and inspecting ultra-fine wires in semiconductor production. Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 ...
Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the ...
With the growing installed base of 3800 Die Bonder customers and the long-standing presence of the 8000 Wire Bonder across the APAC region, Palomar Technologies has successfully expanded the Palomar ...
FORT WASHINGTON, Pa.--(BUSINESS WIRE)--Kulicke & Soffa Industries, Inc. (Nasdaq:KLIC) (“K&S”) introduces two next-generation wire bonders at SEMICON China, in Shanghai. The new IConn PS and the ConnX ...
CARLSBAD, Calif.--(BUSINESS WIRE)--Palomar Technologies, provider of precision automation equipment and process development for microelectronic assembly, announces its new wedge emulation technology ...
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