Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
Vertical Aerospace (London, U.K.), in the middle of its piloted flight test program, has achieved Phase 2 which involved the company’s full-scale VX4 prototype advanced air mobility (AAM) aircraft ...
SiC (silicon carbide) has established itself as an important material in the semiconductor market because it has many outstanding properties. In comparison with silicon, SiC offers a higher electrical ...
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