Lightmatter ®, the leader in photonic interconnect solutions for AI, and Global Unichip Corp. (GUC), the Advanced ASIC leader and a key enabler for hyperscaler AI infrastructure, today announced a ...

Skoltech researchers and their colleagues from Ludwig Maximilian University of Munich, Germany, Nanjing University of China, ...

Evans to bring together MISUMI Americas and Fictiv into a single unified AI-powered platform, MISUMI reports..

2025 was a year that redefined Synopsys and our role in product engineering. The completion of the acquisition of simulation and analysis leader Ansys in July transformed Synopsys overnight from the ...

The 3D-IC market outlook is entering a decisive phase as the semiconductor industry transitions beyond the limits of traditional Moore’s Law scaling. As performance, power efficiency, and system ...

COMSOL Multiphysics version 6.4 accelerates engineering simulations and multiphysics models. Full GPU support across all physics delivers up to 5× speedups in benchmarks. COMSOL now supports GPU ...

Led by Professor Tony Feng Shien-Ping from the Department of Systems Engineering at CityUHK, the research team developed a novel material to address the complex metallisation challenges in the ...

OYAMA, Japan--(BUSINESS WIRE)--Gigaphoton Inc. (Head Office: Oyama, Tochigi; President and CEO: Tatsuo Enami), a manufacturer of lightsources for semiconductor lithography, announced that it has ...

Vinci, the pioneer of Physics-Driven AI for hardware design and simulation, emerged from stealth today and announced $46M in total funding, with its Series A led by Xora Innovation and its Seed round ...