How ASML's Lithography Machines Shape the AI Chip Industry | ASML
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ASML Developing Next-Gen EUV Lithography
ASML Developing Next-Gen EUV Lithography
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ieee.org
【ASML 週報 | DUV 微影系統持續創新中...🚀】 在半導體的世界裡，創新不一定來自最新問世的技術，有時候突破反而藏在那些經過時間淬鍊的系統裡✨ 我們的 DUV 深紫外光微影系統，就像默默耕耘、不斷精進的技術職人，在每一次更新中挑戰極限、刷新表現！ ASML 積極發展極紫外光（EUV）微影系統的同時，也持續投入深紫外光（DUV）技術的進化。別忘了，成熟製程依然是驅動晶片製造、撐起市場需求，甚至改變你我生活的關鍵力量！ #DUV 機台在成熟製程中持續創新 ✨ 浸潤式微影（Immersion systems）：我們的 TWINSCAN NXT:2150i 配備 193 nm ArF 光源，還擁有 1.35 高數值孔徑（NA）。不只穩定精準，現在每小時還能處理多達 310 片晶圓，比上一代 NXT:2100 更快、更靈巧，對準和成像表現也全面升級，幫助客戶降低製程複雜度、提高效率 💡 🌬️ 乾式微影（Dry systems）：不是每一層晶片都需要超高規格的浸潤技術，有時候「穩定發揮」才是關鍵！像是 XT:400M，就是在前代 XT:400L 基礎上再升級，不但支援 200mm
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【ASML 週報 | DUV 微影系統持續創新中...🚀】 在半導體的世界裡，創新不一定來自最新問世的技術，有時候突破反而藏在那些經過時間淬鍊的系統裡✨ 我們的 DUV 深紫外光微影系統，就像默默耕耘、不斷精進的技術職人，在每一次更新中挑戰極限、刷新表現！ ASML 積極發展極紫外光（EUV）微影系統的同時，也持續投入深紫外光（DUV）技術的進化。別忘了，成熟製程依然是驅動晶片製造、撐起市場需求，甚至改變你我生活的關鍵力量！ #DUV 機台在成熟製程中持續創新 ✨ 浸潤式微影（Immersion systems）：我們的 TWINSCAN NXT:2150i 配備 193 nm ArF 光源，還擁有 1.35 高數值孔徑（NA）。不只穩定精準，現在每小時還能處理多達 310 片晶圓，比上一代 NXT:2100 更快、更靈巧，對準和成像表現也全面升級，幫助客戶降低製程複雜度、提高效率 💡 🌬️ 乾式微影（Dry systems）：不是每一層晶片都需要超高規格的浸潤技術，有時候「穩定發揮」才是關鍵！像是 XT:400M，就是在前代 XT:400L 基礎上再升級，不但支援 200mm
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ASML engineers and technicians work in a high-tech environment where cleanroom processes, module builds, and hands-on training come together to produce the world’s most advanced lithography systems used in semiconductor production. | ASML
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＼EUVとDUV、互いに補完し合う中核技術／ シンプルなセンサーから最先端のチップまで。現代のテクノロジーの根幹を支えているのが、DUV（深紫外線）リソグラフィ技術です。 半導体チップの進化において鍵となるのは、「性能向上」と「コスト最適化」をいかにして両立させるかです。そのため半導体メーカー各社は、EUV（極端紫外線）とDUVという2つのリソグラフィ装置を組み合わせることで、回路パターン形成の最適化を図っています。この2つの技術を併用することで、求められる解像度と精度を、より速く、より低コストで実現することが可能になります。 テクノロジーの進化が加速する中、DUVリソグラフィは今なお重要な推進力です。私たちASMLは、半導体メーカーであるお客様のニーズに応じてDUV製品を進化させ、共にテクノロジーの前進を支えていきます。 | ASML
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